Nickel Plating Pen (Micro-Metallizer)
Plate nickel over copper surfaces. Apply copper flash first on non-copper substrates. Essential underlayer for many plating sequences.
Plate nickel over copper surfaces. Apply copper flash first on non-copper substrates. Essential underlayer for many plating sequences.
The Nickel Plating Pen is one of the most-used pens in the Micro-Metallizer system. Beyond standalone nickel plating, it serves as the standard underlayer that gives gold, rhodium, and other precious-metal platings the durable, well-bonded substrate they require.
Electrical contact restoration workflows (PL-1000C kit) typically apply nickel as an intermediate before the final gold layer. The same workflow is used for connector pin and edge-connector repair across electronics and aerospace MRO.
Apply over copper directly. For other substrates (steel, brass, etc.), apply a copper flash with the Copper Plating Pen first. Heavy-duty variant (PL-1020) available.
| Part No. | PL-1006 |
|---|---|
| Metal | Nickel |
| Compatible Surfaces | Copper (apply copper flash on others) |
| Required Compatibles | Absorbent Pen, Power Supply, Connector Cables |
| Shipping Weight | 45 g |
| Dimensions | 18 × 3 × 3 cm (L × W × H) |
This product is in active use across the following industries — click through to see how Hunter Products instruments are deployed in each:
Hunter Products has manufactured precision electroplating instruments in Flemington, New Jersey since 1970. Every order ships direct from our facility — no resellers, no middlemen, no surprise markups.
Bulk pricing and custom kit configurations are available on request. For international orders, technical questions, or to discuss a high-volume requirement, please contact us directly or call (908) 526-8440.